COPPER DIMETHYLDITHIOCARBAMATE (CUDD)

Copper dimethyldithiocarbamate (CuDD) uses and applications include: Primary vulcanization accelerator, thiazole secondary accelerator for rubber molded and extruded goods; accelerator for food-contact rubber articles for repeated use.
Copper dimethyldithiocarbamate (CuDD) is an organometallic coordination compound in which a copper(II) ion is chelated by two dimethyldithiocarbamate ligands through sulfur atoms.
Copper dimethyldithiocarbamate (CuDD) of sulfur-rich ligands results in strong Cu–S bonding, giving the compound high chemical stability and distinctive electronic properties.

CAS Number: 137-29-1
Molecular Formula: C6H12CuN2S4
Molecular Weight: 303.98
EINECS Number: 205-287-8

Synonyms: Copper dimethyldithiocarbamate, Copper(II) dimethyldithiocarbamate, Copper bis(dimethyldithiocarbamate), Cupric N,N-dimethyldithiocarbamate, Dimethyldithiocarbamatocopper, Dimethyldithiocarbamic acid copper salt, Dimethyldithiocarbamic Acid Copper(II) Salt, Carbamic acid dimethyldithio copper(II) salt, Copper(2+) bis(dimethyldithiocarbamate), Copper dimethylcarbamodithioate, Copper(II) Dimethylcarbamodithioate, Copper, bis(dimethylcarbamodithioato-S,S'), Copper, bis(dimethylcarbamodithioato-κS,κS'), Copper, bis(dimethylcarbamodithioato) (SP-4-1), Copper, bis(dimethylcarbamodithioato) (9CI), copper;N,N-dimethylcarbamodithioate, BIS(DIMETHYLDITHIOCARBAMATO)COPPER, BIS(DIMETHYLDITHIOCARBAMATO)COPPER(II), BIS(N,N-DIMETHYL(DITHIOCARBAMATO-S,S'))COPPER, CARBAMODITHIOIC ACID, DIMETHYL-, COPPER(2+) SALT, Cumate, Cumates, Wolfen, Hermat Cu, Compound 4018, CuDMC, Methyl cumate (CuDMC) powder, DMDTC-Cu(II), NSC-32947, NSC32947, RefChem:127861, CHEBI:23410, MFCD00050845, DTXSID2020345, DTXCID60345, SCHEMBL24182, ZOUQIAGHKFLHIA-UHFFFAOYSA-L, AKOS015850769, NCGC00260326-01, Tox21_202780, CAS-137-29-1, C6H12CuN2S4, Bis(dimethylcarbamodithioato-S,S') copper;DIMETHYLDITHIOCARBAMIC ACID COPPER SALT;COPPER(II) DIMETHYLDITHIOCARBAMATE;CUPRIC DIMETHYLDITHIOCARBAMATE;CUMATE;COPPER DIMETHYLDITHIOCARBAMATE;Copper,bis(diMethylcarbaModithioato-kS,kS')-, (SP-4-1)-;Akrochem Cu.D.D

Copper dimethyldithiocarbamate (CuDD) typically appears as a dark green to brown crystalline solid and shows low solubility in water but good solubility in many organic solvents.
Copper dimethyldithiocarbamate (CuDD) belongs to the dithiocarbamate family, which is well known for strong metal-binding ability and broad industrial relevance.
Its coordination geometry around the copper center is commonly square-planar or slightly distorted, which influences its magnetic and redox behavior.

These structural features make copper dimethyldithiocarbamate a useful model compound in coordination chemistry and materials-related research.
Copper dimethyldithiocarbamate (CuDD) is also valued for its functional performance arising from controlled thermal and chemical decomposition.
Upon heating, it can act as a precursor for copper sulfide phases, which are important in electronic and catalytic applications.

In addition, its interaction with biological and chemical systems has led to interest in antimicrobial and surface-protective applications.
Copper dimethyldithiocarbamate (CuDD) exhibits notable thermal stability due to strong coordination between the copper(II) center and sulfur donor atoms.
The electron-donating nature of the dimethyldithiocarbamate ligands modifies the electronic density of the copper ion and affects its redox behavior.

This electronic structure contributes to its usefulness in studies involving metal–ligand charge transfer and coordination chemistry.
Copper dimethyldithiocarbamate (CuDD) demonstrates limited volatility and undergoes controlled decomposition when exposed to elevated temperatures.
During thermal decomposition, sulfur-containing fragments facilitate the formation of copper sulfide species with defined stoichiometry.

This behavior makes Copper dimethyldithiocarbamate (CuDD) a valuable single-source precursor in thin-film deposition and nanomaterial synthesis.
In chemical and biological systems, copper dimethyldithiocarbamate can interact with enzymes and cellular components through metal ion exchange and sulfur coordination.

These interactions are associated with antimicrobial and antifungal activity observed for many copper dithiocarbamate complexes.
As a result, the compound has attracted interest in surface protection, agricultural chemistry, and functional material development.

Melting point: 260 °C
Boiling point: 415.51 °C (estimated)
Density: 1.75 g/cm³
Vapor pressure: 0 Pa at 25 °C
Form: powder to crystal
Color: orange to amber to dark red
Specific gravity: 1.75
Hydrolytic sensitivity: 4 (no reaction with water under neutral conditions)
InChI: InChI=1S/2C3H7NS2.Cu/c21-4(2)3(5)6;/h21-2H3,(H,5,6);/q;;+2/p-2
InChIKey: ZOUQIAGHKFLHIA-UHFFFAOYSA-L
SMILES: C(=S)(S[Cu]SC(=S)N(C)C)N(C)C
LogP: 4.55

Copper dimethyldithiocarbamate (CuDD) shows strong resistance to hydrolysis under neutral and mildly acidic conditions.
This stability allows the compound to maintain its coordination structure during storage and handling in industrial environments.
Copper dimethyldithiocarbamate (CuDD)s low water solubility also contributes to prolonged persistence when applied in solid or coated forms.

The sulfur-rich ligand environment enhances the affinity of the compound toward soft metal centers and surfaces.
This characteristic enables effective interaction with metal substrates and contributes to its performance as a protective or functional additive.
Such interactions are particularly relevant in corrosion-related and surface-modification applications.

From a materials science perspective, Copper dimethyldithiocarbamate (CuDD) is frequently studied as a molecular precursor for copper-based semiconducting materials.
Copper dimethyldithiocarbamate (CuDD)s predictable decomposition pathway supports controlled synthesis of copper sulfide layers with tunable properties.
These properties are important for applications in photovoltaics, sensors, and catalytic systems.

Copper dimethyldithiocarbamate (CuDD) is a very powerful primary accelerator and can serve as a secondary booster for thiazoles & sulphenamides accelerators. 
It finds use in natural as well as many synthetic rubbers such as SBR, EPDM and butyl.
Copper dimethyldithiocarbamate (CuDD) in butyl rubber, combines good process safety with a high rate of cure when used with MBT or its derivatives.

Copper dimethyldithiocarbamate (CuDD) Granules are premium quality granules that are widely used in industrial applications. 
With a purity range of 80-99%, these granules are highly effective and deliver optimal results. 
The round-shaped granules have a normal smell and are easy to handle and store at room temperature. 

These granules are made using top-grade materials and are manufactured by experienced professionals to ensure that they meet the highest quality standards. 
With their exceptional properties, the Copper dimethyldithiocarbamate (CuDD) Granules are ideal for use in various industrial processes.
Copper dimethyldithiocarbamate (CuDD) is one of numerous organometallic compounds sold by American Elements under the trade name AE Organometallics. 

Copper dimethyldithiocarbamate (CuDD)s are useful reagent, catalyst, and precursor materials with applications in thin film deposition, industrial chemistry, pharmaceuticals, LED manufacturing, and others. 
American Elements supplies Copper dimethyldithiocarbamate (CuDD) in most volumes including bulk quantities and also can produce materials to customer specifications. 

Uses Of Copper dimethyldithiocarbamate (CuDD):
Copper dimethyldithiocarbamate (CuDD) is used as an ultraaccelerator or vulcanization agent for SBR (styrenebutadiene), IR (polyisoprene isoprene), and EPDM (ethylene-propylene terpolymer) rubbers. 
Copper dimethyldithiocarbamate (CuDD) is often used as a stabilizer/antioxidant for synthetic elastomers or polyethers.
Copper dimethyldithiocarbamate (CuDD) is widely used as a fungicidal and antimicrobial agent due to its ability to disrupt metabolic enzyme systems in microorganisms.

Its effectiveness is largely attributed to the release of copper ions and sulfur-containing species that interfere with cellular respiration and protein function.
For this reason, it has been applied in agricultural formulations and protective coatings to inhibit biological growth.
The compound is also employed as a metal chelating and stabilizing additive in polymer and rubber industries.

Copper dimethyldithiocarbamate (CuDD) acts as an accelerator or secondary additive by improving resistance to thermal degradation and oxidative aging.
These properties make it valuable in elastomer processing and long-term material stabilization.
In materials science and electronics, copper dimethyldithiocarbamate is used as a single-source precursor for copper sulfide thin films and nanostructures.

Copper dimethyldithiocarbamate (CuDD)s controlled thermal decomposition enables precise formation of semiconducting copper sulfide phases.
This application is important for the fabrication of sensors, photovoltaic devices, and catalytic materials.
Copper dimethyldithiocarbamate (CuDD) is used in antifouling and protective coatings to limit microbial growth on industrial and marine surfaces.

Copper dimethyldithiocarbamate (CuDD)s copper-based activity provides long-lasting protection against biofilm formation and surface deterioration.
This application is particularly relevant in humid or water-exposed environments.
Copper dimethyldithiocarbamate (CuDD) is also applied in rubber compounding as a secondary accelerator and stabilizer.

It enhances vulcanization efficiency while improving resistance to heat and oxidative aging.
These properties contribute to improved mechanical durability and service life of rubber products.
In research and development settings, Copper dimethyldithiocarbamate (CuDD) is utilized as a model compound for studying thermal decomposition kinetics.

Copper dimethyldithiocarbamate (CuDD)s well-defined breakdown pathway allows detailed investigation of reaction mechanisms and activation energies.
Such studies support the development of advanced precursor systems for functional materials.
Copper dimethyldithiocarbamate (CuDD) is used as a protective agent in wood preservation and surface treatments to prevent fungal and microbial degradation.

Its strong affinity with biological sulfur-containing enzymes enhances its long-term biocidal effectiveness.
This makes it suitable for applications where prolonged antimicrobial protection is required.
Copper dimethyldithiocarbamate (CuDD) is also utilized in analytical and coordination chemistry as a reference material for studying metal–dithiocarbamate complexes.

Copper dimethyldithiocarbamate (CuDD) helps in understanding metal–sulfur bonding, ligand field effects, and decomposition mechanisms.
Such studies are important for the design of advanced coordination compounds and catalysts.

In industrial research, Copper dimethyldithiocarbamate (CuDD) is applied as a precursor in the synthesis of copper-containing catalysts.
Its decomposition products can form catalytically active copper sulfide or copper oxide phases depending on processing conditions.
These catalysts are used in reactions such as oxidation, hydrogenation, and environmental remediation processes.

Safety Profile Of Copper dimethyldithiocarbamate (CuDD):
Copper dimethyldithiocarbamate (CuDD) may cause skin and eye irritation upon direct contact due to the presence of copper ions and sulfur-containing ligands.
Prolonged or repeated exposure can lead to sensitization and inflammatory responses, particularly in occupational settings.
Protective gloves, eyewear, and appropriate handling procedures are recommended to minimize contact.

Inhalation of dust or decomposition fumes may result in respiratory irritation and discomfort.
At elevated temperatures, Copper dimethyldithiocarbamate (CuDD) can decompose to release toxic sulfur-containing gases and copper fumes.
Adequate ventilation and temperature control are therefore essential during processing and thermal treatment.

Copper dimethyldithiocarbamate (CuDD) is considered harmful to aquatic organisms and may cause long-term environmental effects.
Its low water solubility does not eliminate ecological risk due to persistence and bioaccumulation of copper species.
Proper disposal and environmental management practices are required to prevent contamination of soil and water systems.