PRODUCTS

COPPER PYROPHOSPHATE

CAS NUMBER: 10102-90-6

EC NUMBER: 239-250-2

MOLECULAR FORMULA: Cu2O7P2

MOLECULAR WEIGHT: 301.04

IUPAC NAME: dicopper;phosphonato phosphate

OTHER NAMES: Diphosphoric acid, copper salt/Copper pyrophosphate

Copper Pyrophosphate is an inorganic chemical compound of copper from the group of pyrophosphates
Copper Pyrophosphate can be used for metal surface treatment and for galvanic copper plating

Copper Pyrophosphate is generally immediately available in most volumes.
Copper Pyrophosphate has High purity, submicron and nanopowder forms may be considered.

Pyrophosphate Copper Plating:
Pyrophosphate copper plating is widely used copper plating process, which has been used in many electroplating plants in china.
This process is characterized by its stability of plating solution, meticulous crystalline coating, a better dispersion ability and coverage ability than that of acidic copper plating and higher cathodic current efficiency than cyanide copper plating.
And a thick coating can be obtained with no irritating gas escaping from the electroplating process, which can spare the ventilation equipment.

Copper Pyrophosphates bath solution is non-toxic, not corrosive to equipment, which makes it especially suitable for circuit printing and zinc alloy die castings.
However, the preparation cost of the plating solution is high, and the long-term use (usually within a few years) will cause the accumulation of orthophosphate
So that the deposition rate will decrease significantly.
In addition, direct pyrophosphate copper plating on the kinds of metal base with low electric potential such as steel, aluminum alloy and zinc alloy, will fail without preplating or pretreatment, which ensures the bonding force between the coating and the substrate.

Copper Pyrophosphate, which is the main raw material for the preparation of copper plating bath, is mainly used for non-cyanide plating.
Copper Pyrophosphate reacts in the bath with potassium pyrophosphate, the complexing agent, to form pyrophosphate copper ligand ion:

Cu2P2O7+3K4P2O7 = 2K6[Cu (P2O7) 2];

c→6K++[Cu (P2O7) 2]6-

Copper content in plating bath has a significant effect on the cathodic polarization and current density range.
The copper content in plating bath is controlled at 22~27g/L in the common copper plating, and 27~35g/L for bright copper plating.

Low copper content will give a low deposition rate, a narrow current density range allowed and poor brightness and smoothness
And high copper content will decrease the cathode polarization and result in a rough plating coat.
In this case, to get a good coating, a corresponding increase in the content of potassium pyrophosphate is needed
But it will also increase the viscosity of the plating solution and thus reduce the conductive ability and dispersion ability of the plating bath
And the plating solution loss adhered to workpiece surface will be increased, resulting in the increase of production cost and the burden of wastewater treatment.
Because of its complexation effect on divalent bivalent copper ion and tetravalent tin ion, potassium pyrophosphate is the main complexing agent in the bath.
In addition to the copper complex, there must be free to keep a certain amount of potassium pyrophosphate in the plating bath to make the complex more stable and prevent copper pyrophosphate from precipitation, therefore to improve the dispersive ability of the bath and ensure the normal dissolution of the anodes.

Physical and Chemical Properties of Copper Pyrophosphate:
Copper Pyrophosphate appears as light green powder soluble in acid and not soluble in water.
Copper Pyrophosphate can react with potassium pyrophosphate to form soluble potassium pyrophosphatecopper(Ⅱ).

Extraction and Representation:
Copper Pyrophosphate can be obtained by reacting copper (II) oxide with diammonium hydrogen phosphate , with copper (II) phosphate Cu 3 (PO 4 ) 2 or copper (II) metaphosphate Cu (PO 3 ) 2 arise.
Synthesis by reacting copper (II) oxide with boron phosphate at 900 ° C or copper (II) phosphate at 750 ° C is also possible

Properties:
Copper Pyrophosphate is a light blue solid with a characteristic odor, which is practically insoluble in water.
Two monoclinic crystal structures are known of Copper Pyrophosphate.
Changes in properties near the transition from the α phase with the space group C 2 / c (space group no. 15) to the β phase with the space group C 2 / m (space group no. 12) indicate the presence of another Intermediate phase in the temperature range 347–363 K out

Application:
Copper Pyrophosphate is mainly used in non-cyanide plating, supplying copper ions in the plating bath.
Copper Pyrophosphate is used in the copper base of decorative maskant and carburization.
Copper Pyrophosphate is used as analytical reagent.
Copper Pyrophosphate is used in the preparation of phosphate pigments.
Copper Pyrophosphate is widely used in copper plating industry for decorative protective copper layer and anti-carburization carburization coating.

Due to its high purity, unique crystal structure, and extremely low Fe, Ph, As contents, our copper pyrophosphate is much easier to be chelated by potassium pyrophosphate.
Plating solution has excellent polarizing ability and current distribution ability.
Fresh plating solution does not need to go through electrolysis procedure and can be directly used for electroplating.

Copper Pyrophosphate Advantages:
-plating ratio is fast
-plating layer is smooth
-And there is no cavity crystal structure
-The plating solution is stable with simple maintenance.

Synthesis:
Double Decomposition
The copper sulfate and the anhydrous sodium pyrophosphate solution are respectively dissolved into solutions of certain concentration.
After filtering and purification, the copper sulfate solution is added into the reactor, and a predetermined amount of anhydrous sodium pyrophosphate solution is added dropwise under the stirring for metathesis reaction to form copper pyrophosphate.
Control pH between 5 and 5.5.

And Copper Pyrophosphate is obtained after:
-filtration
-rinsing with water
-centrifugal separation
-drying

Copper Pyrophosphate is used in electroplating copper
Copper Pyrophosphate was one of the constituents in the preparation of an electrolyte which was used to study the application of nickel-tin (Ni-Sn) nanowires as electrodes for Li-ion batteries.
Copper Pyrophosphate are light blue powder
Copper Pyrophosphate can soluble in acid, insoluble in water.
Copper Pyrophosphate can be soluble in potassium pyrophosphate solution and form complex pyrophosphate solution.

Copper Pyrophosphate comes as a light blue powder with a copper content of 34% minimum.
Copper Pyrophosphate is soluble in water.
Copper Pyrophosphate is used in surface treatment for copper plating
Copper Pyrophosphate is used in agrochemicals
Also Copper Pyrophosphate can used for the manufacture of pesticides.

Copper Pyrophosphate appears as a blue powder.
Copper Pyrophosphate is used for metal surface treatment
Copper Pyrophosphate is used for alkaline copper plating.

Compound Type:
-Copper Compound
-Industrial/Workplace Toxin
-Inorganic Compound
-Synthetic Compound

The main use of pyro copper is plating of printed circuit boards.
The bath has good throwing power, obtaining surface-to-hole ratios of 1:1 on many PC boards.
Some federal agencies specify pyro copper where ductility of the deposit is very important.
Copper Pyrophosphate is also used for general plating, electroforming and plating on plastics.
Even here, though, sulfate acid copper has the largest market share.

Pyrophosphate copper baths are mildly alkaline, making them less corrosive than acid baths.
They are essentially non-toxic.
They are easy to waste treat, but the phosphate ion is considered a controlled pollutant in some regions.
In these cases, controlled waste treatment is required.

Specially formulated pyrophosphate baths can be used for copper strikes on steel and zincated aluminum.
Immersion coatings may form on zinc die castings thus cyanide copper strikes are typically used.

Copper Pyrophosphate are light blue powder
Copper Pyrophosphate can insoluble in water.
Copper pyrophosphate can be soluble in potassium pyrophosphate solution and form complex pyrophosphate solution.
Copper Pyrophosphate is widely used in copper plating industry for decorative protective copper layer and anti-carburization carburization coating.
Due to its high purity, unique crystal structure, and extremely low Fe, Ph, As contents, our copper pyrophosphate is much easier to be chelated by potassium pyrophosphate.

Plating solution has excellent polarizing ability and current distribution ability.
Fresh plating solution does not need to go through electrolysis procedure and can be directly used for electroplating.
Copper Pyrophosphate is widely used in copper plating industry for decorative protective copper layer and anti-carburization carburization coating.

Copper Pyrophosphate is a compound composed of pyrophosphate ion and copper ion.
Copper Pyrophosphates molecular formula is Cu2P2O7
Copper Pyrophosphates molecular weight is 301.03

Copper Pyrophosphates aqueous solution is weak alkaline
So Copper Pyrophosphate should be kept dry and ventilated during storage and transportation
Copper Pyrophosphate can not be mixed with acid products
Copper Pyrophosphate Mainly used in non-cyanide plating, printed circuit plastic plating and electroforming, in the copper under layer of decorative protective layer

Copper Pyrophosphate is a chemical compound of copper.
Copper is a chemical element with the symbol Cu and atomic number 29.
Copper is an essential elements in plants and animals as it is required for the normal functioning of more than 30 enzymes.
Copper Pyrophosphate occurs naturally throughout the environment in:
-rocks
-soil
-water
-air

Copper Pyrophosphate belongs to the class of inorganic compounds known as transition metal pyrophosphates.
These are inorganic compounds in which the largest oxoanion is pyrophosphate, and in which the heaviest atom not in an oxoanion is a transition metal.

Substituents:
-Transition metal pyrophosphate
-Inorganic copper salt
-Inorganic oxide
-Inorganic salt

Copper Pyrophosphate is used as an additive for electroplating, the preparation of phosphate pigment.
Copper Pyrophosphate is used in printed circuit boards.
Copper Pyrophosphate catalyzes the dimerization of isobutylene to diisobutylene.

Copper Pyrophosphate is involved in the electrodeposition of copper-zinc alloys based electrolytes.
Further, Copper Pyrophosphate is used in animal feed as a supplement.
Copper Pyrophosphate is used in plating of copper on plastics, aluminum, and zinc

PHYSICAL PROPERTIES OF COPPER PYROPHOSPHATE:

-Molecular Weight: 301.04

-Hydrogen Bond Donor Count: 0

-Hydrogen Bond Acceptor Count: 7

-Rotatable Bond Count: 0

-Exact Mass: 299.771121

-Monoisotopic Mass: 299.771121

-Topological Polar Surface Area: 136 Å²

-Solubility in water: insoluble

-Solubility: soluble in ammonia

-Solubility product (Ksp): 1.4×10−37

-LogP:0.87190

-Color: Blue

-Form: Powder

Copper Pyrophosphate is an inorganic chemical compound of copper from the group of pyrophosphates
Copper Pyrophosphate can be used for metal surface treatment and for galvanic copper plating
Copper Pyrophosphate, which is the main raw material for the preparation of copper plating bath, is mainly used for non-cyanide plating.

Copper Pyrophosphate reacts in the bath with potassium pyrophosphate, the complexing agent, to form pyrophosphate copper ligand ion:
Copper Pyrophosphate is mainly used in non-cyanide plating, supplying copper ions in the plating bath.
Copper Pyrophosphate is used in the copper base of decorative maskant and carburization.

Copper Pyrophosphate is used as analytical reagent.
Copper Pyrophosphate is used in the preparation of phosphate pigments.
Copper Pyrophosphate is widely used in copper plating industry for decorative protective copper layer and anti-carburization carburization coating.

Copper Pyrophosphate should be kept dry and ventilated during storage and transportation
Copper Pyrophosphate can not be mixed with acid products
Copper Pyrophosphate is used as an additive for electroplating, the preparation of phosphate pigment.

CHEMICAL PROPERTIES OF COPPER PYROPHOSPHATE:

-Heavy Atom Count: 11

-Formal Charge: 0

-Complexity: 124

-Isotope Atom Count: 0

-Defined Atom Stereocenter Count: 0

-Undefined Atom Stereocenter Count: 0

-Defined Bond Stereocenter Count: 0

-Undefined Bond Stereocenter Count: 0

-Covalently-Bonded Unit Count: 3

-Compound Is Canonicalized: Yes

-logP: -1.4

-pKa (Strongest Acidic): 1.7

-Refractivity: 21.04 m³·mol⁻¹

-Polarizability: 9.03 Å³

STORAGE OF COPPER PYROPHOSPHATE:

Copper Pyrophosphate should be stored in a cool environment.
Copper Pyrophosphate should be stored in a dry place.
Copper Pyrophosphate can be easily stored as it is suitable for air transportation.

Copper Pyrophosphate should be kept in a regularly ventilated place.
Copper Pyrophosphate should be kept tightly closed.

Copper Pyrophosphate should not be stored together with acids.
Copper Pyrophosphate should not be stored with food products.
Copper Pyrophosphate should be stored under constant pressure.

Copper Pyrophosphate should be stored in a cold environment.
Copper Pyrophosphate should be kept in a place where there are no sudden temperature changes.
Copper Pyrophosphate should be kept in a damp and dry place.

SYNONYMS:

Cupric pyrophosphate
Dicopper pyrophosphate
Copper(II) pyrophosphate
dicopper;phosphonato phosphate
copper(II) diphosphate
copper(ii) py-rophosphate
Cu2P2O7
2Cu.P2O7
Copper( cento) pyrophosphate
Copper(II) pyrophosphate-3-hydrate
Copper pyrophosphate; Diphosphoric acid copper salt
Diphosphoric acid alpha,alpha:beta,beta-dicopper(II) salt
Copper diphosphate
Copper(Ⅱ) pyrophosphate
Cupricpyrophosphate
Tetracopper pyrophosphate