TEPIC-G

TEPIC-G is a highly functional epoxy crosslinking agent characterized by three reactive glycidyl (epoxy) groups attached to an isocyanurate ring structure.
TEPIC-G's molecular structure consists of a rigid isocyanurate ring core substituted with three reactive glycidyl ether groups, enabling the formation of highly dense three-dimensional polymer networks during curing.
TEPIC-G is widely utilized in powder coating formulations, particularly for exterior-grade applications where weather resistance, UV stability, and long-term durability are critical.

CAS Number: 2451-62-9
EC Number: 219-514-3
Molecular Formula: C12H15N3O6
Molecular Weight: 297.27 g/mol

Synonyms: Poly(glycidyl isocyanurate), T 1005, T 810, T 810 (hardener), TEPIC, TEPIC-G, TEPIC-H, TEPIC-L, TEPIC-P, TEPIC-S, TEPIC-SP, TGI X, TGIC, Triglycidylisocyanurate homopolymer, Triglycidyl isocyanurate polymer, Vestagon BF 1430, XB 2615, s-Triazine-2,4,6(1H,3H,5H)-trione, 1,3,5-tris(2,3-epoxypropyl)-, polymers(8CI), Araldite 710, Araldite 813, Araldite PT 810, Araldite PT 816, AralditeTGIC, ETs, ETs (cyanuric acid derivative), Epikote RXE 15, Glycidylisocyanurate polymer, Metallon E 5010, PP 9210D, PPT 12544D, PT 710, PT 810

TEPIC-G is a high-performance trifunctional epoxy compound derived from triglycidyl isocyanurate chemistry, designed to act as an efficient crosslinking agent in thermosetting resin systems.
TEPIC-G's molecular structure consists of a rigid isocyanurate ring core substituted with three reactive glycidyl ether groups, enabling the formation of highly dense three-dimensional polymer networks during curing.
This high functionality results in coatings and resin systems with superior hardness, excellent chemical resistance, outstanding solvent resistance, and enhanced mechanical strength.

TEPIC-G is widely utilized in powder coating formulations, particularly for exterior-grade applications where weather resistance, UV stability, and long-term durability are critical.
When reacted with carboxyl-functional polyester resins, TEPIC-G produces coatings with excellent gloss retention, color stability, and corrosion protection.
In addition to coatings, TEPIC-G is also employed in advanced composites, electrical encapsulation materials, adhesives, and structural laminates where thermal stability and dimensional integrity under stress are essential.

The inherent thermal resistance of the isocyanurate ring contributes to high glass transition temperatures (Tg) and improved performance at elevated temperatures.
Furthermore, TEPIC-G cures without releasing volatile by-products, making it suitable for environmentally responsible, solvent-free systems.
TEPIC-G's combination of reactivity, structural rigidity, and durability makes it a preferred component in demanding industrial and protective applications requiring long service life and consistent performance.

TEPIC-G is a mixture of two optical stereoisomers, alpha and beta, which have different physicochemical properties.
There are two main technical grades of TEPIC-G.
These are Araldite PT 810 (also known as TK 10622), and TEPIC-G.

TEPIC-G is a highly functional epoxy crosslinking agent characterized by three reactive glycidyl (epoxy) groups attached to an isocyanurate ring structure.
This trifunctional configuration enables the formation of dense, three-dimensional thermoset networks when reacted with carboxyl-functional polyester resins or other suitable curing systems.
As a result, coatings formulated with TEPIC-G exhibit excellent hardness, strong adhesion, superior chemical resistance, and outstanding weather and UV stability.

TEPIC-G is predominantly used in polyester powder coating systems designed for exterior durability, including architectural aluminum profiles, automotive components, appliances, and industrial equipment.
TEPIC-G's high crosslink density contributes to improved mechanical performance, abrasion resistance, and long-term environmental stability.
In addition to powder coatings, TEPIC-G may also be utilized in specialty epoxy formulations and electrical insulation materials where enhanced thermal and chemical resistance are required.

TEPIC-G is a trifunctional epoxy crosslinking agent based on a highly stable isocyanurate ring structure containing three reactive glycidyl (epoxy) groups.
This unique molecular configuration provides high reactivity and enables the formation of tightly crosslinked polymer networks when cured with appropriate hardeners such as carboxyl-functional polyesters, amines, or anhydrides.

TEPIC-G is typically used in powder coatings, high-performance composites, adhesives, and electrical insulation systems where excellent thermal stability, chemical resistance, hardness, and weather durability are required.
TEPIC-G's ability to cure without generating volatile by-products makes it suitable for solvent-free and environmentally compliant formulations.
The rigid heterocyclic core contributes to outstanding heat resistance and long-term mechanical performance in demanding industrial applications.

Uses of TEPIC-G:
TEPIC-G is widely used as a high-functionality epoxy crosslinking agent in thermosetting systems requiring superior mechanical strength, chemical resistance, and thermal stability.
TEPIC-G is primarily incorporated into polyester-based powder coatings for exterior architectural and industrial applications where long-term weather durability, gloss retention, and corrosion resistance are essential.

TEPIC-G is also applied in protective coatings for metal substrates exposed to aggressive environments, as well as in electrical encapsulation materials and laminates due to its excellent dielectric properties and heat resistance.
In addition, TEPIC-G is utilized in high-performance adhesives, structural bonding systems, advanced composites, and epoxy flooring formulations where high crosslink density contributes to improved hardness, abrasion resistance, and dimensional stability.

Powder Coatings:
TEPIC-G is used in polyester-based powder coatings for outdoor architectural, industrial, and automotive applications requiring excellent weather resistance, gloss retention, and corrosion protection.

Protective Coatings:
TEPIC-G is applied in heavy-duty protective coatings for metal substrates exposed to chemicals, moisture, and harsh environmental conditions.

Electrical Insulation Materials:
TEPIC-G is utilized in electrical encapsulation compounds, electrical laminates, and insulation systems due to its high thermal stability and dielectric properties.

Adhesives and Structural Bonding:
TEPIC-G is incorporated into high-performance adhesive formulations where strong mechanical strength and heat resistance are essential.

Composites and Laminates:
TEPIC-G is used in advanced composite materials and fiber-reinforced systems requiring high glass transition temperature and dimensional stability.

Industrial Flooring Systems:
TEPIC-G is applied in epoxy flooring and mortar systems to enhance hardness, abrasion resistance, and chemical durability.

TEPIC-G has a wide variety of industrial applications such as:
Print circuit board (PCB)
Top-coated ink
Solder-resistant ink (PCB solder mask)
High performance SRI for PC and Cell Phone
Short circuit prevention: Permanent protective coating of PCB
Increased heat and solvent resistance– Resolving power up
Transparent encapsulate (LED, CCD)
Semiconductor encapsulate
Plastic, rubber, and adhesive additive
Outdoor polyester powder coating

Industrial Uses:
TEPIC-G is a white powder or granular solid and is normally sold under the trade name ARALDITE PT810R or TEPIC-G R.
As a tri-functional epoxy monomer, TEPIC-G is used in large scale as curing agent for powder coatings or for cross-linking elastomers.

Rosin acids of natural origin may also be cured with TEPIC-G for versatile applications.
TEPIC-G has also been used for pharmaceutical purposes, in membranes, for curing intelligent gels or liquid crystal elastomers.

Especially, this curing agent has been widely used in dry powder coating for over 40 years.
Industry claims are that the powders melt and chemically react during heat curing to form a stable polymeric matrix in which TEPIC-G is chemically bound to the polymer, and cannot contaminate the environment (Powder Coating Institute)[1]

Structure of TEPIC-G:
TEPIC-G possesses a symmetric, trifunctional molecular structure built around a central isocyanurate ring.
The isocyanurate core is a six-membered heterocyclic ring composed of alternating carbonyl (C=O) and nitrogen (–N–) groups, forming a thermally stable triazine-type structure.

Attached to each of the three nitrogen atoms of the isocyanurate ring is a glycidyl (epoxy) group.
These glycidyl substituents contain reactive oxirane (three-membered epoxy) rings, which are responsible for the compound’s high reactivity and crosslinking capability.
Because there are three epoxy groups per molecule, TEPIC-G exhibits trifunctionality, allowing it to form highly crosslinked three-dimensional polymer networks when cured.

This combination of a rigid heterocyclic core and three reactive epoxy groups results in high thermal stability, elevated glass transition temperature (Tg), strong mechanical performance, and excellent chemical resistance in cured systems.

Production of TEPIC-G:
TEPIC-G is produced through the glycidylation of isocyanuric acid with epichlorohydrin under controlled alkaline conditions.
In the first step, isocyanuric acid reacts with excess epichlorohydrin to form intermediate chlorohydrin derivatives.
This reaction typically takes place in the presence of a suitable catalyst and under temperature-controlled conditions to ensure complete substitution of the three reactive nitrogen sites on the isocyanurate ring.

In the subsequent step, dehydrochlorination is carried out using an alkaline agent such as sodium hydroxide.
This process converts the chlorohydrin intermediates into epoxy (oxirane) groups, forming TEPIC-G.
The reaction mixture is then washed to remove inorganic salts and residual alkali, followed by purification steps such as filtration, vacuum stripping, and crystallization.

The final product is obtained as a white crystalline solid or powder with controlled epoxy equivalent weight and high purity.
Strict process control is applied to minimize residual epichlorohydrin and ensure consistent reactivity, functionality, and thermal performance suitable for high-performance epoxy and powder coating applications.

Synthesis of TEPIC-G:
TEPIC-G is typically synthesized by reacting isocyanuric acid with excess epichlorohydrin to form chlorohydrin intermediates, followed by base-induced dehydrohalogenation to close the epoxide (oxirane) rings.
In practice, isocyanuric acid is suspended/dissolved in epichlorohydrin (often with a phase-transfer catalyst), then an alkali such as NaOH is added to convert the chlorohydrin groups into three glycidyl (epoxy) groups on the isocyanurate ring.
After reaction, salts are removed by washing/filtration, residual epichlorohydrin is stripped (often under vacuum), and the product is purified by crystallization to yield a white crystalline TGIC/TEPIC-G with controlled epoxy value and low impurities.

Stability and Reactivity of TEPIC-G:

Chemical stability:
TEPIC-G is chemically stable under normal conditions of storage and handling in dry, closed containers.

Reactivity:
TEPIC-G reacts with curing agents such as amines.
Anhydrides.
Carboxyl-functional resins in an exothermic polymerization reaction.

Conditions to avoid:
Excessive heat.
Open flames.

Moisture contamination.
Uncontrolled mixing with curing agents.
Dust formation.

Incompatible materials:
Strong acids.
Strong bases.

Strong oxidizing agents.
Reactive amines in uncontrolled conditions.

Hazardous decomposition products:
Thermal decomposition or combustion may produce carbon oxides (CO, CO₂).
Nitrogen oxides (NOx).
Irritating organic fumes.

Handling and Storage of TEPIC-G:

Handling:
Avoid inhalation of dust.
Avoid skin and eye contact.

Use adequate ventilation.
Prevent dust accumulation.
Follow good industrial hygiene practices.

Storage:
Store in a cool, dry, well-ventilated area away from heat sources and direct sunlight.

Storage conditions:
Keep containers tightly sealed to protect from moisture and contamination.

Shelf life:
Stable when stored properly in original unopened packaging under recommended conditions.

First Aid Measures of TEPIC-G:

Inhalation:
Move the affected person to fresh air and keep at rest.
Seek medical attention if respiratory symptoms persist.

Skin contact:
Remove contaminated clothing.
Wash affected skin thoroughly with soap and water.

Eye contact:
Rinse cautiously with plenty of water for at least 15 minutes.
Seek medical attention if irritation continues.

Ingestion:
Rinse mouth with water.
Do not induce vomiting.
Seek medical advice if symptoms occur.

Firefighting Measures of TEPIC-G:

Suitable extinguishing media:
Dry chemical powder.
Carbon dioxide (CO₂).

Foam.
Water spray.

Specific hazards:
Combustion may produce toxic fumes including carbon oxides.
Nitrogen oxides.

Protective equipment:
Firefighters should wear self-contained breathing apparatus (SCBA).
Full protective gear.

Accidental Release Measures of TEPIC-G:

Personal precautions:
Avoid dust formation.
Ensure adequate ventilation.
Wear appropriate personal protective equipment.

Environmental precautions:
Prevent material from entering drains, surface water, or soil.

Methods for cleanup:
Sweep or collect spilled material carefully to avoid dust dispersion.
Place in suitable containers for disposal according to regulations.

Exposure Controls / Personal Protective Equipment of TEPIC-G:

Engineering controls:
Use local exhaust ventilation to control airborne dust levels.

Respiratory protection:
Wear a dust mask or approved respirator if airborne particles are generated.

Hand protection:
Use chemical-resistant gloves such as nitrile or neoprene.

Eye protection:
Wear safety goggles or face shield.

Skin protection:
Wear protective clothing to prevent prolonged skin contact.

Identifiers of TEPIC-G:
Trade Name: TEPIC-G
CAS Number: 2451-62-9
EC Number: 219-514-3
Molecular Formula: C₁₂H₁₅N₃O₆
Molecular Weight: 297.27 g/mol
InChI key: OUPZKGBUJRBPGC-UHFFFAOYSA-N
InChI: 1S/C12H15N3O6/c16-10-13(1-7-4-19-7)11(17)15(3-9-6-21-9)12(18)14(10)2-8-5-20-8/h7-9H,1-6H2
SMILES string: O=C1N(CC2CO2)C(=O)N(CC3CO3)C(=O)N1CC4CO4

Empirical Formula (Hill Notation): C12H15N3O6
CAS Number: 2451-62-9
Molecular Weight: 297.26
NACRES: NA.23
PubChem Substance ID: 24863665
UNSPSC Code: 12162002
EC Number: 219-514-3
MDL number: MFCD00080670

Chemical Family: Trifunctional epoxy compound
CAS Number: 2451-62-9
EC Number: 219-514-3
Molecular Formula: C12H15N3O6
Molecular Weight: 297.27 g/mol
Physical State: Solid
Appearance: White to off-white crystalline powder or flakes

CAS RN.: 28825-96-9
EINECS: 219-514-3
Molecular Weight: 297.264
Molecular Formula: C12H15N3O6
Density: 1.625 g/cm3
Boiling Point(℃): 501.1 °C at 760 mmHg
Flash Point(℃): 256.9 °C

Properties of TEPIC-G:
Appearance: White crystalline solid or fine powder
Odor: Mild characteristic odor
Epoxy Equivalent Weight (EEW): Approximately 100–110 g/eq
Epoxy Functionality: 3 reactive epoxy groups
Melting Point: Approximately 90–110°C
Density: ~1.3–1.4 g/cm³ at 25°C

ECH content: max. 100 ppm
Epoxy Equivalent Weight: max. 110 g/equiv.
Hydrolyzable Chlorine: max. 2.0%
Melting Point: 90 - 125°C
Particle Size (mesh 99%): 4 - 42nm
Viscosity at 120°C: max. 100

Physical state: Solid
Appearance: White to off-white
Odor: Mild or nearly odorless
Melting point: Approx. 90–110 °C
Epoxy equivalent weight (EEW): Approx. 100–110 g/eq
Density (25 °C): Approx. 1.30–1.35 g/cm³
Solubility: Slightly soluble in water; soluble in many organic solvents
Flash point: >200 °C (typical)

Description: White, granular solids with no discernible odour.
Purity: 90% (TEPIC-G) >97%
Melting point: 90-125° C
95° C (Araldite PT 810, TK 10622)
105° C (a -TGIC)
156° C (b -TGIC)
Boiling point: -
Density: 1.42 g/ml (TEPIC-G)
1.46 g/ml (Araldite PT 810, TK 10622)
Vapour pressure: 0.05 x 10-6 mmHg (7.2 m Pa) at 20° C