Phenol-formaldehyde resin is a synthetic thermosetting polymer produced by the chemical reaction of phenol and formaldehyde.
Phenol-formaldehyde resin is known for its excellent heat resistance, mechanical strength, dimensional stability, chemical resistance, and electrical insulating properties.
Phenol-formaldehyde resin is commonly used in the manufacture of molded components, adhesives, laminates, coatings, and electrical insulation materials.
Product Name: PHENOL-FORMALDEHYDE RESIN
CAS: 9003-35-4
MF: (C6H6O.CH2O)x
MW: 124.14
EINECS: 500-005-2
MOL File: 9003-35-4.mol
CBNumber:CB8274689
Synonyms:Phenolic resin, Novolac, Phenolic resins, phenol-formaldehyde, P-F-R-2, Phenolic resin 264, phenol, polymer with formaldehyde, RESOLE, -formaL, Phenolpac
DESCRIPTION
Phenol-formaldehyde resin is one of the earliest commercially developed synthetic polymers.
Phenol-formaldehyde resin is formed through a condensation reaction between phenol and formaldehyde, resulting in a polymer structure containing aromatic rings connected by methylene bridges.
The properties of the resin depend on the phenol-to-formaldehyde ratio, reaction conditions, catalysts, and curing process.
Phenol-formaldehyde resin can be supplied in liquid, powder, flake, or granule form, depending on the intended application.
After curing, Phenol-formaldehyde resin forms a rigid, cross-linked structure that provides excellent thermal stability, hardness, and resistance to many chemicals.
Phenolic resins are widely valued for their durability, flame resistance, and ability to maintain their structural integrity under demanding operating conditions.
Properties
Melting point: 94 °C
Boiling point: 229.3℃[at 101 325 Pa]
Density: 1.10 g/cm3
Vapor pressure: 3.18Pa at 25℃
Storage temp.: Sealed in dry, Room
Temperature Form: Granule Color: Light yellow
Water Solubility: 1.557mg/L at 25℃
Dielectric constant: 4.5 (Ambient)
Stability: Stable.
Incompatible with strong oxidizing agents.
InChI: InChI=1S/C6H6O.CH2O/c7-6-4-2-1-3-5-6;1-2/h1-5,7H;1H2
InChIKey: SLGWESQGEUXWJQ-UHFFFAOYSA-N
Chemical Properties
The phenolic resins most widely used are low molecular weight butylated resols, which contain phenolic hydroxyl groups and etherified and unetherified methylol groups.
The epoxy resins used have a molecular weight of 3000-4000 and therefore contain secondary hydroxyl groups.
Uses
Phenol-formaldehyde resin is used in binders, adhesives, laminates, impregnation products, surface coatings, casting sand, etc.
Industrial uses
Phenol-formaldehyde resin is a synthetic resin, commonly known as phenolic, made by the reaction of phenol and formaldehyde, and employed as a molding material for the making of mechanical and electrical parts. The resins are also used for laminating, coatings, and casting resins.
Phenolic resins are used most extensively as thermosetting plastic materials, as there are only a few uses as thermoplastics.
The polymer is composed of carbon, hydrogen, oxygen, and sometimes nitrogen.
Its molecular weight varies from a very low value during its early state of formation to almost infinity in its final state of cure.
The chemical configuration, in the thermoset state, is usually represented by a threedimensional network in which the phenolic nuclei are linked by methylene groups.
The completely cross-linked network requires three methylene groups to two phenolic groups.
A lesser degree of cross-linking is attainable either by varying the proportions of the ingredients or by blocking some of the reactive positions of the phenolic nucleus by other groups, such as methyl, butyl, etc.
Reactivity can be enhanced by increasing the hydroxyl groups on the phenolic nuclei, for example, by the use of resorcinol.
The outstanding characteristics of phenolics are good electrical properties, very rigid set, good tensile strength, excellent heat resistance, good rigidity at elevated temperature, good aging properties; also, good resistance to water, organic solvents, weak bases, and weak acids.
All these characteristics are coupled with relatively low cost.
Industrial uses
Phenolic resins are used for low-cost partsrequiring good electrical insulating properties,heat resistance, or chemical resistance.
Theaverage shelf life of this resin is about 1 monthat 21.1°C.
This can be extended by storing it ina refrigerator at 1.6 to 10°C.
Varying the catalyst(according to the thickness of the cast) andraising the cure temperature to 93°C will alterthe cure time from as long as 8 h to as short as15 min.
Some shrinkage occurs in the finished casting(0.012 to 0.6 mm/mm), depending on thequantity of filler, amount of catalyst, and therate of cure. Faster cure cycles produce a higherrate of shrinkage.
Since the cure cycle can beaccelerated, phenolics are used in short-runcasting operations.
Cast phenolic parts are easily removed fromthe mold if the parting agents recommended bythe supplier are used.
Posteuring improves thebasic properties of the finished casting.